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TESPA-HAR
Geometry
RectangularTip Radius (nm)
Nom: 10
Max: 15
Frequency (KHz)
Nom: 320
Min: 230
Max: 410
Length (µm)
Nom: 125
Min: 140
Max: 110
Spring Const (N/m)
Nom: 42
Min: 20
Max: 80
Width (µm)
Nom: 40
Min: 30
Max: 50
Order a free TESPA-HAR sample
Price: $1,039.50 (USD)
Sold in packs of 10
Questions? Free, Online Consulting
Overview
42N/m, 320kHz, High Aspect Ratio Tip (5:1), Aluminum Reflective Coating
High aspect ratio (HAR) probes are based upon Bruker technology and made from Bruker TESP probes using focused ion beam milling techniques. The HAR process modifies the top portion of the tip to an aspect ratio of at least 5:1. These probes are ideal for Tappingmode imaging on samples with tall/deep geometries, such as semiconductor trench imaging.
High aspect ratio (HAR) probes are based upon Bruker technology and made from Bruker TESP probes using focused ion beam milling techniques. The HAR process modifies the top portion of the tip to an aspect ratio of at least 5:1. These probes are ideal for Tappingmode imaging on samples with tall/deep geometries, such as semiconductor trench imaging.
Tip Specification
Tip Height (h): 10 - 15 µm
Front Angle (FA): 5 ± 1º
Back Angle (BA): 5 ± 1º
Side Angle (SA): 5 ± 1º
Cantilever Specification
Material: 0.01 - 0.025 Ωcm Antimony (n) doped Si
Geometry: Rectangular
Cantilevers Number: 1
Cantilever Thickness (Nom): 4µm
Cantilever Thickness (RNG): 3.25 - 4.75µm
Back Side Coating: Reflective Aluminum
Top Layer Back: 45 ± 5nm of Al